Low dielectric inorganic composition for multilayer ceramic pack

Details Low dielectric inorganic composition for multilayer ceramic pack Low dielectric inorganic composition for multilayer ceramic pack

1990-10-25

1992-06-02

Dixon, Jr., William R.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 16, 501 18, 501 49, 501 61, 501133, 501134, 252520, 428210, 428901, C03C 824, C03C 802, C03C 818, H01B 106

Patent

active

051186438

ABSTRACT:
A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2 at 1 MHz and a linear thermal expansion coefficient of 2.5-3.0 ppm/.degree. C. from room temperature to 200.degree. C. The composition comprises a mixture of finely divided particles of 25-50 vol. % borosilicate glass and 50-75 vol. % titanium silicate glass. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

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patent: 4879261 (1989-11-01), Burn

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