Low dielectric inorganic composition for multilayer ceramic pack

Details Low dielectric inorganic composition for multilayer ceramic pack Low dielectric inorganic composition for multilayer ceramic pack

1990-08-23

1991-12-10

Group, Karl

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 32, 501 54, 501 65, 501 66, C03C 822, C03C 416

Patent

active

050717936

ABSTRACT:
A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2. The composition is formed from a mixture of finely divided particles of 25-50 vol. % borosilicate glass and 50-75 vol. % high silica glass. The borosilicate glass comprises approximately 20-35 wt. % B.sub.2 O.sub.3 and approximately 60-80 wt. % SiO.sub.2. The high silica glass contains essentially 0.5-1 wt. % alumina, 1-5 wt. % B.sub.2 O.sub.3 and approximately 95-98 wt. % SiO.sub.2. The composition can be fired at a temperature of less than 1000.degree. C.

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patent: 4939021 (1990-07-01), Aoki et al.

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