Low dielectric inorganic composition for multilayer ceramic pack

Details Low dielectric inorganic composition for multilayer ceramic pack Low dielectric inorganic composition for multilayer ceramic pack

1991-08-26

1992-08-25

Group, Karl

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

156 89, 501 65, 501134, 501 32, C03C 820

Patent

active

051418991

ABSTRACT:
A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2 at 1 MHz and a linear thermal expansion coefficient of 2.5-3.0 ppm/.degree.C. from room temperature to 200.degree. C. The composition comprises a mixture of finely divided particles of 20-50 wt. % borosilicate glass, 40-75 wt. % titanium silicate glass and sufficient amounts of crystalline ceramic material to inhibit the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.

REFERENCES:
patent: 4642148 (1987-02-01), Kurihara et al.
patent: 4672152 (1987-06-01), Shinohara et al.
patent: 4755490 (1988-07-01), DiLizzaro
patent: 4788046 (1988-11-01), Barringer et al.
patent: 4879261 (1989-11-01), Burn
patent: 5071793 (1991-12-01), Jean et al.

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