Low dielectric fiber glass composition having improved water res

Details Low dielectric fiber glass composition having improved water res Low dielectric fiber glass composition having improved water res

1987-06-19

1988-08-09

Dixon, Jr., William R.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 55, 501 66, 264DIG19, C03C 1300

Patent

active

047628090

ABSTRACT:
A SiO.sub.2 13 B.sub.2 O.sub.3 fiber glass composition is disclosed which contains a reduced amount of B.sub.2 O.sub.3 in comparison with conventional D glass to thereby improve the water resistance and heat resistance. The fiber glass composition of the present invention has a dielectric constant of 4.5 or less for 1 MHz at the room temperature, a strain point of 485.degree. C. or more, and improved water resistance. The composition consists essentially of, by weight SiO.sub.2 70-80%, Al.sub.2 O.sub.3 0-2.0%, B.sub.2 O.sub.3 15.0-21.5%, MgO 0-1.0%, CaO 0-2.0%, Li.sub.2 O 0-2.0%, Na.sub.2 O 0-3.0%, and K.sub.2 O 0-3.0%, Li.sub.2 O+Na.sub.2 O+K.sub.2 O=2.0-5.0%.

REFERENCES:
patent: 4097258 (1978-06-01), Horikawa et al.
"Handbook of Fillers and Reinforcements for Plastics", Van Nostrand Reinhold Co. pp. 480-481.
"Handbook of Glass Data", O. Mazurin et al., Elseuier Pub. pp. 571, 597.
"Technology of Glass and Ceramics", J. Hlavac, Elsevier Pub. pp. 186-188.

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