Low dielectric constant microsphere filled layers for multilayer

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156230, 156246, 1563071, B32B 3100

Patent

active

057857890

ABSTRACT:
Disclosed are multilayer electrical structures comprising a discrete, partially-cured, microsphere-filled resin layer, and a method for fabricating such multilayer electrical structures using a carrier member to support and introduce the microsphere-filled resin layer.

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