Low Dielectric constant materials for high speed electronics

Details Low Dielectric constant materials for high speed electronics Low Dielectric constant materials for high speed electronics

1995-03-27

1996-11-19

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174258, 361761, 361762, 361765, H05K 103, H05K 118

Patent

active

055765173

ABSTRACT:
An electronic structure includes a circuit chip having chip pads and supported by a substrate, and a low dielectric constant porous polymer layer having pores and situated over the substrate and circuit chip. The porous polymer layer has at least one via therein aligned with at least one of the chip pads, and a pattern of electrical conductors extends over a portion of the porous polymer layer and into the at least one via. The pattern of electrical conductors does not significantly protrude into the pores of the porous polymer layer.

REFERENCES:
patent: 3812224 (1974-05-01), Smith et al.
patent: 3843570 (1974-10-01), Murayama
patent: 3962153 (1976-06-01), Gore
patent: 4096227 (1978-06-01), Gore
patent: 4721831 (1988-01-01), Vora
patent: 4744008 (1988-05-01), Black et al.
patent: 4751136 (1988-06-01), Kamiya
patent: 4781969 (1988-11-01), Kobayashi et al.
patent: 4783695 (1988-11-01), Eichelberger et al.
patent: 4835704 (1989-05-01), Eichelberger et al.
patent: 4857381 (1989-08-01), Suzuki
patent: 5034801 (1991-07-01), Fischer
patent: 5087641 (1992-02-01), Sato
patent: 5169678 (1992-12-01), Cole et al.
patent: 5302547 (1994-04-01), Wojnarowski et al.
patent: 5315486 (1994-05-01), Fillion et al.
patent: 5359496 (1994-10-01), Kornrumpf et al.
patent: 5418687 (1995-05-01), Chen
"Fabrications Of Controlled Porosity In A Tape Cast Glass Ceramic Substrate Material", 6046 Materials Letters, 1989 Aug., No. 8, Amsterdam, NL, pp. 278-282.
"Fabrications Of Printed Circuit Wiring Boards Using Insulation Layers With Low Dielectric Constant", IBM Technical Disclosure Bulletin, vol. 31, No. 7, Dec. 1988, pp. 25-26.
"UV-Laser Photoablation Of Thermostable Polymers: Polymides, Polyphenylquinoxaline And Teflon AF", Mat. Res. Soc. Symp. Proc Vol. 227, 1991 Materials Research Society, pp. 253-259.
"Giants In Advanced Ceramics", Ceramic Industry, Aug. 1993, pp. 47-51.
"Dielectric Properties Measurement Of Substrate And Support Materials" By TE-KAO WU, Microwave And Optical Technology Letters, vol. 3, No. 8, Aug. 1990, pp. 283-286.
Handbook Of Chemistry And Physics, 60th Ed., pp. C722-723.

Affiliated with

Also associated with

Rating

Low Dielectric constant materials for high speed electronics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low Dielectric constant materials for high speed electronics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low Dielectric constant materials for high speed electronics will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-542562