Low Dielectric constant materials for high speed electronics

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174258, 361761, 361762, 361765, H05K 103, H05K 118

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active

055765173

ABSTRACT:
An electronic structure includes a circuit chip having chip pads and supported by a substrate, and a low dielectric constant porous polymer layer having pores and situated over the substrate and circuit chip. The porous polymer layer has at least one via therein aligned with at least one of the chip pads, and a pattern of electrical conductors extends over a portion of the porous polymer layer and into the at least one via. The pattern of electrical conductors does not significantly protrude into the pores of the porous polymer layer.

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