Low dielectric constant material having thermal resistance,...

Details Low dielectric constant material having thermal resistance,... Low dielectric constant material having thermal resistance,...

2007-03-20

2007-03-20

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Metal compound containing

C252S521500, C528S394000, C528S007000, C423S276000

Reexamination Certificate

active

11294412

ABSTRACT:
There is provided a low dielectric constant material, which is excellent in thermal resistance, has low dielectric constant, and is applicable to a semiconductor device or electric appliances, an insulation film between semiconductor layers using the same, and the semiconductor device. The material is the low dielectric constant material having thermal resistance, which contains borazine skeletal molecules shown by the following formula (1) and the like in an inorganic or organic material molecule.

REFERENCES:
patent: 3288726 (1966-11-01), Wagner
patent: 5188757 (1993-02-01), Paine et al.
patent: 5855962 (1999-01-01), Cote et al.
patent: 6458719 (2002-10-01), Tsunoda et al.
patent: 7-196372 (1995-08-01), None
patent: 10-209146 (1998-08-01), None
Wideman et al., “Second-Generation Polymeric Precursons for BN and SiNCB Ceramic Materials,” Appl. Organometal. Chem. 12, 681-693 (1998).
U.S. Appl. No. 11/294,412, filed Dec. 6, 2005, Tsunoda et al.
H. Shibata, “Low-κ Interlayer Dielectric Technology for High Performance LSIs”, Technical Survey, Densijyouhoutsuusin Gakkaishi, vol. 80, No. 3, pp. 235-239 (Mar. 1997).
Y. Kimura, “BN Fiber as a Main Topic of Inorganic Fibers”, Department of Polymer Science and Engineering, Kyoto Institute of Technology, Sennitokogyou, vol. 52, No. 8, pp. 341-345 (1996).
R.T. Paine, et al., “Recent Developments in Borazine-Based Polymers”, American Chemical Society, Chapter 27, pp. 358-374 (1994).
P.J. Fazen, et al., “Synthesis and Ceramic Conversion Reactions of Polyborazylene”, Polymer Preprints, vol. 32, pp. 544-545 (1991).
C.K. Narula, et al., “Synthesis of Boron Nitride Ceramics from Poly (Borazinylamine) Precursors”, J. Am. Chem. Soc., vol. 109, pp. 5556-5557 (1987).
A.T. Lynch, et al., “Transition-Metal-Promoted Reactions of Boron Hydrides, 12.'Syntheses, Polymerizations, and Ceramic Conversion Reactions of B-Alkenylborazines”, J. Am. Chem. Soc., vol. 111, pp. 6201-6209 (1989).
Paine, et al., “Synthetic Routes of Boron Nitride”, Chem. Rev., vol. 90, pp. 73-91 (1990).
Electronic Engineering Times (2004).
AIST Today International Edition No. 5 (2002).

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