Low dielectric constant material having thermal resistance,...

Compositions – Fluent dielectric – B- – p- – s- – se- – or te-containing

Reexamination Certificate

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C252S570000, C252S575000, C428S411100, C428S414000, C438S778000, C257S758000

Reexamination Certificate

active

07029605

ABSTRACT:
There is provided a low dielectric constant material, which is excellent in thermal resistance, has low dielectric constant, and is applicable to a semiconductor device or electric appliances, an insulation film between semiconductor layers using the same, and the semiconductor device. The material is the low dielectric constant material having thermal resistance, which contains borazine skeletal molecules shown by the following formula (1) and the like in an inorganic or organic material molecule.

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