Low dielectric constant material for use as an insulation elemen

Details Low dielectric constant material for use as an insulation elemen Low dielectric constant material for use as an insulation elemen

1997-04-04

1999-03-30

Berman, Susan W.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524546, 524544, 4284758, 361750, C08L 2714, B32B 700, H01B 344

Patent

active

058891048

ABSTRACT:
A low dielectric constant material is provided for use as an insulation element in an electronic device, such as but not limited to an integrated circuit structure for example. Such a low dielectric constant material may be formed from an aqueous fluoropolymer microemulsion or microdispersion. The low dielectric constant material may be made porous, further lowering its dielectric constant. The low dielectric constant material may be deposited by a spin-coating process and patterned using reactive ion etching or other suitable techniques.

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