Low dielectric constant insulation layer for integrated circuit

Details Low dielectric constant insulation layer for integrated circuit Low dielectric constant insulation layer for integrated circuit

1993-06-28

1995-11-28

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437978, 437195, H01L 2102

Patent

active

054708010

ABSTRACT:
A low dielectric insulation layer for an integrated circuit structure material, and a method of making same, are disclosed. The low dielectric constant insulation layer comprises a porous insulation layer, preferably sandwiched between non-porous upper and lower insulation layers. The presence of some gases such as air or an inert gas, or a vacuum, in the porous insulation material reduces the overall dielectric constant of the insulation material, thereby effectively reducing the capacitance of the structure. The porous insulation layer is formed by a chemical vapor deposition of a mixture of the insulation material and a second extractable material; and then subsequently selectively removing the second extractable material, thereby leaving behind a porous matrix of the insulation material, comprising the low dielectric constant insulation layer.

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