Low dielectric constant fluorine and carbon-containing...

Compositions: ceramic – Ceramic compositions – Refractory

Reexamination Certificate

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C501S151000, C257S632000, C257S646000

Reexamination Certificate

active

07015168

ABSTRACT:
The invention provides a process for forming a low k fluorine and carbon-containing silicon oxide dielectric material by reacting with an oxidizing agent one or more silanes containing one or more organofluoro silanes having the formula SiR1R2R3R4, where: (a) R1is selected from H, a 3 to 10 carbon alkyl, and an alkoxy; (b) R2contains at least one C atom bonded to at least one F atom, and no aliphatic C—H bonds; and (c) R3and R4are selected from H, alkyl, alkoxy, a moiety containing at least one C atom bonded to at least one F atom, and ((L)Si(R5)(R6))n(R7); where n ranges from 1 to 10; L is O or CFR8; each n R5and R6is selected from H, alkyl, alkoxy, and a moiety containing at least one C atom bonded to at least one F atom; R7is selected from H, alkyl, alkoxy, and a moiety containing at least one C atom bonded to at least one F atom; and each R8is selected from H, alkyl, alkoxy, and a moiety containing at least one C atom bonded to at least one F atom. Also provided is a low dielectric constant fluorine and carbon-doped silicon oxide dielectric material for use in an integrated circuit structure which contains: silicon atoms bonded to oxygen atoms; silicon atoms bonded to carbon atoms; and carbon atoms bonded to fluorine atoms; where the dielectric material also has a characteristic selected from: (a) the presence of at least one C—C bond; (b) the presence of at least one carbon atom bonded to from 1 to 2 fluorine atoms; and (c) the presence of at least one silicon atom bonded to from 0 to 2 oxygen atoms.

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