Low dielectric constant ceramic materials

Details Low dielectric constant ceramic materials Low dielectric constant ceramic materials

1988-05-17

1991-11-26

Group, Karl

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 17, 501 61, C03C 1400, C03C 3108

Patent

active

050682105

ABSTRACT:
A dense, sintered ceramic material having a low dielectric constant, a low firing temperature, and a low coefficient of thermal expansion is provided from a mixture of 0-30 wt. % alumina, 30-60 wt. % fused silica, and 30-70 wt. % of a glass comprised of PbO, B.sub.2 O.sub.3, and SiO.sub.2. The mixture has a minimum sintering temperature in the range of 800.degree.-900.degree. C., and can be formed by conventional manufacturing techniques. It is particularly useful for the fabrication of single or multilayer electronic circuit substrates.

REFERENCES:
patent: 3258352 (1966-06-01), Paymal
patent: 3503763 (1970-03-01), Mills
patent: 3970465 (1976-07-01), Houben
patent: 4520115 (1985-05-01), Speit et al.
patent: 4624934 (1986-11-01), Kokubu et al.
patent: 4654095 (1987-03-01), Steinberg
patent: 4655864 (1987-04-01), Rellick
patent: 4755490 (1988-07-01), DiLazzaro

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