Low dielectric ceramic compositions for multilayer ceramic packa

Details Low dielectric ceramic compositions for multilayer ceramic packa Low dielectric ceramic compositions for multilayer ceramic packa

1996-12-04

1998-07-28

Marchesohi, Michale

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 6, 501 9, 501 21, 428433, 428901, C03C 416, C03C 1008

Patent

active

057862885

ABSTRACT:
A crystallizable ceramic composition for forming a ceramic dielectric body having a dielectric constant in the range of 4.8-5.3 at 1 MHz and a linear thermal expansion coefficient of 4.0-5.1.times.10.sup.-6 K.sup.-1 in the temperature range of 25.degree.-200.degree. C. The dielectric composition comprises a mixture of finely divided particles of 10-90 wt % Mg-Al-Si glass and 10-90 wt % Ca-Al-B-Si glass. The dielectric composition can be used with organic solvents, polymeric binder and plasticizer to produce an unfired green tape which is cofirable with high electrical conductivity metallurgies such as gold, silver, silver-palladium and copper.

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