Low density high surface area copper powder and electrodepositio

Details Low density high surface area copper powder and electrodepositio Low density high surface area copper powder and electrodepositio

1998-02-04

2000-03-14

Wong, Edna

Electrolysis: processes, compositions used therein, and methods

Electrolytic synthesis

Preparing single metal

205280, C25C 112

Patent

active

06036839&

ABSTRACT:
This invention relates to a low density high surface area copper powder having an apparent density in the range of about 0.20 to about 0.60 gram per cubic centimeter, and a surface area of at least about 0.5 square meter per gram. This invention also relates to an electrodeposition process for making the foregoing copper powder by electrodepositing the copper powder from an electrolyte solution using a critical combination of process parameters. These critical parameters include: a copper ion concentration for the electrolyte solution in the range of about 2 to about 7 grams per liter; a free chloride ion concentration for the electrolyte solution in the range of about 8 to about 20 ppm; an impurity level for the electrolyte solution of no more than about 1.0 gram per liter; and an electrolyte solution that is free of organic additives.

REFERENCES:
patent: 5458746 (1995-10-01), Burgess et al.
patent: 5516408 (1996-05-01), Peckham et al.
patent: 5520792 (1996-05-01), Burgess et al.
patent: 5670033 (1997-09-01), Burgess et al.
Eamon et al., "Plant Practices & Innovations at Magma Copper Company's San Manuel SX-EW Plant", TMS Symposium, New Orleans, Louisiana, pp. 1-17, Feb. 1991.
Database WPI, XP002096785, Derwent Publications Ltd., London, Great Britain, 1 page. Aug. 1990.
Database WPI, XP002096786, Derwent Publications Ltd., London, Great Britain, 1 page. Oct. 1989.
International Search Report, International Application No. PCT/US98/26943, dated Mar. 25, 1999.

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