Low defect density, ideal oxygen precipitating silicon

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Reexamination Certificate

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C428S064100, C117S932000

Reexamination Certificate

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11058996

ABSTRACT:
The present invention is directed to a silicon wafer which, during the heat treatment cycles of essentially any arbitrary electronic device manufacturing process, may form an ideal, non-uniform depth distribution of oxygen precipitates and may additionally contain an axially symmetric region which is substantially free of agglomerated intrinsic point defects.

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