Acoustics – Diaphragm and enclosure
Reexamination Certificate
2005-06-08
2010-06-01
Donels, Jeffrey (Department: 2832)
Acoustics
Diaphragm and enclosure
C181S199000, C252S512000, C174S388000
Reexamination Certificate
active
07726440
ABSTRACT:
Vehicle electrical and electronic components are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.
REFERENCES:
patent: 2295483 (1942-09-01), Knowles
patent: 4496875 (1985-01-01), Barth et al.
patent: 4610808 (1986-09-01), Kleiner
patent: 5093037 (1992-03-01), Ohi et al.
patent: 5206476 (1993-04-01), Fresch et al.
patent: 5220152 (1993-06-01), Doran
patent: 5304746 (1994-04-01), Purvine
patent: 5406038 (1995-04-01), Reiff et al.
patent: 5430618 (1995-07-01), Huang
patent: 5504655 (1996-04-01), Underwood et al.
patent: 5761046 (1998-06-01), Hein et al.
patent: 6052472 (2000-04-01), Lo
patent: 6117366 (2000-09-01), Park et al.
patent: 6157546 (2000-12-01), Petty et al.
patent: 6238599 (2001-05-01), Gelorme et al.
patent: 6369320 (2002-04-01), Okamoto
patent: 6624353 (2003-09-01), Gabower
patent: 6942060 (2005-09-01), Sugiura et al.
patent: 7026382 (2006-04-01), Akiba et al.
patent: 7142434 (2006-11-01), Beihoff et al.
patent: 7338619 (2008-03-01), Hagano et al.
patent: 7351361 (2008-04-01), Shimizu et al.
patent: 2002/0074142 (2002-06-01), Katz
patent: 2002/0130570 (2002-09-01), Howe et al.
patent: 2002/0162672 (2002-11-01), Cook et al.
patent: 2004/0251078 (2004-12-01), Kung
patent: 2005/0006119 (2005-01-01), Cunningham et al.
patent: 2005/0167188 (2005-08-01), Aisenbrey
patent: 2005/0167189 (2005-08-01), Aisenbrey
patent: 2005/0183871 (2005-08-01), Hou
patent: 2005/0192727 (2005-09-01), Shostak et al.
patent: 2005/0224280 (2005-10-01), Aisenbrey
patent: 2005/0230867 (2005-10-01), Aisenbrey
patent: 2005/0247471 (2005-11-01), Archambeault et al.
patent: 2007/0278004 (2007-12-01), Dalzell et al.
patent: 2008/0049949 (2008-02-01), Snider et al.
patent: 2008/0067792 (2008-03-01), Breed
patent: 2008/0102294 (2008-05-01), Kitajima et al.
patent: 2377449 (2001-07-01), None
Co-pending U.S. Appl. No. 11/148,064, filed Jun. 8, 2005, Low Cost Vehicle Electrical and Electronic Components and Systems Manufactured From Conductive Loaded Resin-Based Materials, assigned to the same assignee as the present invention.
Donels Jeffrey
Integral Technologies, Inc.
Phillips Forrest M
Schnabel Douglas R.
LandOfFree
Low cost vehicle electrical and electronic components and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low cost vehicle electrical and electronic components and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low cost vehicle electrical and electronic components and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4181109