Low cost system for effecting high density interconnection betwe

Details Low cost system for effecting high density interconnection betwe Low cost system for effecting high density interconnection betwe

1995-09-19

1998-05-19

Pascal, Robert

Electric lamp and discharge devices: systems

Plural power supplies

Plural cathode and/or anode load device

315350, 257429, 257 82, 257 84, G09G 310

Patent

active

057540098

ABSTRACT:
An interfacing system adapted for use with integrated circuits and accompanying devices. The inventive system includes an array of field emissive devices (36) which emit an electrons in response to input signals from multiple first circuits (14) on a first substrate (16). The field emissive devices (36) are located on the first substrate (16). An array of detectors (38) on a second substrate (20) receive the electrons across a (gap (42) between the first substrate (16) and the second substrate (20). A potential difference in response to a source of potential (22) between the first substrate (16) and the second substrate (20) accelerates the electrons across the vacuum gap (42). The interfacing system (10) may be constructed with a diameter of less than ten micrometers. Hence, two substrates with multiple circuits may be interfaced with many thousands of parallel connections per square centimeter without the need for multiplexing.

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