Low-cost semiconductor device package process

Details Low-cost semiconductor device package process Low-cost semiconductor device package process

1985-06-24

1990-03-13

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563311, 1563315, 174 522, 437 1, 437210, 437218, B32B 3100

Patent

active

049080865

ABSTRACT:
An adhesive composition for attaching semiconductor die to a substate of a semiconductor device package includes a crosslinkable resinous polyimide, and an aminosilane cross-linking agent. For applications where backside contact to the semiconductor die is desired, the composition also contains finely divided conductive metal, such as silver flakes. When used in a novel process in which the adhesive composition is placed on the semiconductor device substrate prior to gelling, outgassed, a semiconductor die is placed on the outgassed composition, and the composition cured, the resulting semiconductor device package meets military specifications with a substantial cost reduction.

REFERENCES:
patent: 3229445 (1966-01-01), Kraft
patent: 4183838 (1980-01-01), Gagliani
patent: 4238528 (1980-12-01), Angelo et al.
patent: 4400870 (1983-08-01), Islam

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