Low-cost semiconductor device package and process

Details Low-cost semiconductor device package and process Low-cost semiconductor device package and process

1984-06-29

1985-08-13

James, Andrew J.

357 80, H01L 2302, H01L 3902

Patent

active

045353506

ABSTRACT:
An adhesive composition for attaching semiconductor die to a substrate of a semiconductor device package includes a crosslinkable resinous polyimide, and an aminosilane crosslinking agent. For applications where backside contact to the semiconductor die is desired, the composition also contains finely divided conductive metal, such as silver flakes. When used in a novel process in which the adhesive composition is placed on the semiconductor device substrate prior to gelling, outgassed, a semiconductor die is placed on the outgassed composition, and the composition cured, the resulting semiconductor device package meets military specifications with a substantial cost reduction.

REFERENCES:
patent: 3113252 (1963-12-01), Matea
patent: 3179634 (1965-04-01), Edwards
patent: 3288754 (1966-11-01), Green
patent: 3568012 (1971-02-01), Ernst
patent: 3615913 (1971-10-01), Shaw
patent: 4017886 (1977-04-01), Tomono
patent: 4142203 (1979-02-01), Dietz
patent: 4417386 (1983-11-01), Exner
patent: 4423435 (1983-12-01), Test

Affiliated with

Also associated with

Rating

Low-cost semiconductor device package and process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low-cost semiconductor device package and process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low-cost semiconductor device package and process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2321537