Low-cost saw packaging technique

Details Low-cost saw packaging technique Low-cost saw packaging technique

1990-08-20

1991-10-22

Budd, Mark O.

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

310344, 310346, H01L 4108

Patent

active

050598481

ABSTRACT:
A low-cost SAW device package comprises a ceramic or glass carrier chip, a SAW device substrate mounted on the carrier chip via a conventional adhesive and a package cover mounted over the SAW device by a glass frit. The glass frit provides a tight vacuum seal for the SAW device so that outside contamination is prevented. The package cover is fabricated of a low-cost nonmetallic, non-single crystalline material (i.e. glass) having thermal characteristics similar to or the same as those of the SAW device substrate. The packaged SAW device is mounted into a circuit or subsystem using conventional bonding techniques.

REFERENCES:
patent: 4047129 (1977-09-01), Ishiyama
patent: 4213104 (1980-07-01), Cullen et al.
patent: 4295102 (1981-10-01), Schmidt et al.
patent: 4296347 (1981-10-01), Weirauch
patent: 4333342 (1982-06-01), Gilden et al.
patent: 4737742 (1988-04-01), Takoshima et al.
patent: 4845397 (1989-07-01), Herrick et al.
patent: 4933588 (1990-06-01), Greer
"A Miniature Hybrid Circuit SAW Oscillator Using an All Quartz Packaged Rnator", by Montress et al., (1985 IEEE Ultrasonic Symposium Proceedings).

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