Low cost reduced blooming device and method for making the same

Metal treatment – Compositions – Heat treating

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148187, 357 31, 357 91, 427 431, H01L 2714, H01L 21263

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active

043583237

ABSTRACT:
An image sensing device includes a wafer having a first input sensing surface region and a second charge storage surface region. A recombination layer extends along the first surface and is spaced therefrom. The method for forming the recombination layer is also disclosed.

REFERENCES:
patent: 3676727 (1972-07-01), Dalton et al.
patent: 3810796 (1974-05-01), Skaggs et al.
patent: 3888701 (1975-06-01), Tarneja et al.
patent: 3895430 (1975-07-01), Wilson et al.
patent: 4047976 (1977-09-01), Bledsoe et al.
patent: 4228446 (1980-10-01), Kramer
patent: 4232245 (1980-11-01), Savoye et al.
"High Light Level Blooming in Silicon Vidicons", E. C. Douglas, IEEE Trans. on Electron Devices, vol. ED-22, pp. 224-234, May, 1975.
"Theory, Design, and Performance of Low-Blooming Silicon Diode Array Imaging Targets", B. M. Singer et al., IEEE Trans. on Electron Devices, vol. ED-21, pp. 84-89, Jan., 1974.

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