Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1997-07-22
1999-09-28
Kincaid, Kristine
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257788, 257790, H01L 2328
Patent
active
059592478
ABSTRACT:
An electronic circuit assembly includes a printed circuit board having a plurality of conductors formed thereon. An integrated circuit die is mounted directly on and bonded to the circuit board. A plurality of microleads extend between the integrated circuit die and conductors and are ultrasonically bonded to the die and conductors. A protective coating deposited on the circuit board encapsulates the circuit die and microleads. Methods for depositing the coating include flow and cure, immersion and plasma spray techniques.
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Armstrong Joseph H.
Kapuria Anil K.
Misra Mohan S.
Kincaid Kristine
Ngo Hung V
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