Low cost programmable CPU package/substrate

Details Low cost programmable CPU package/substrate Low cost programmable CPU package/substrate

2006-02-28

2006-02-28

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Contacts or leads including fusible link means or noise...

C257S173000, C257S529000, C257S910000, C438S132000, C438S215000, C438S281000, C438S333000, C438S467000, C438S601000

Reexamination Certificate

active

07005727

ABSTRACT:
A programmable package with a fuse embedded therein, and fabrication method are provided. The fuse has first and second terminal ends joined by a central portion defining a fusible link. The ends include a portion of the first and second conductive layers, the central portion including a portion of the first conductive layer. The first layer may be electroless copper and the second layer may be electrolytic copper. The fuse may have a dog-bone or a bow tie shape. The method includes providing a substrate with a dielectric layer, and forming the fuse by depositing first conductive layer, forming and patterning second conductive layer over a portion of the first layer, and patterning first layer to form interconnects between areas of the second layer.

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