Low-cost power device package with quick-connect terminals and e

Details Low-cost power device package with quick-connect terminals and e Low-cost power device package with quick-connect terminals and e

1985-03-18

1986-09-16

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29591, 148 15, 357 72, 357 80, 357 81, H01L 2334, H01L 2348, H01L 2328

Patent

active

046113894

ABSTRACT:
A semiconductor device package structure having a conventional base outline, a heat spreader, and top-mounted, quick-connect terminals for external connection is described. A pre-packaged semiconductor device is attached to a lead frame containing terminals in a predetermined configuration, and then overmolded with a plastic encapsulant so that the heat spreader of the prepackaged device protrudes a predetermined distance from the mounting surface of the package to make possible good thermal contact with a heat sink. Insulated means to facilitate mounting are built-in.

REFERENCES:
patent: 3290564 (1966-12-01), Romano
patent: 3729573 (1973-02-01), Coldren
patent: 3783347 (1974-02-01), Fichot et al.
patent: 4117508 (1974-02-01), De Ross
patent: 4158745 (1979-02-01), Keller
patent: 4199654 (1981-01-01), Koenig
patent: 4249034 (1981-01-01), Vladik
patent: 4252864 (1981-01-01), Dunn
patent: 4259685 (1981-01-01), Wolff

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