Low-cost package for electronic components

Details Low-cost package for electronic components Low-cost package for electronic components

1994-01-18

1995-06-27

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257676, 257687, 257692, 257787, 361728, H01L 2328

Patent

active

054281881

ABSTRACT:
A low cost package uses non-ceramic materials to environmentally seal an air chamber for an electronic component. The package includes a base formed by a plurality of essentially flat terminals molded in a polyphenylene sulfide resin so as to provide a planar surface for surface mounting to a circuit board. A component placement area on the base receives a cap which covers and seals the area from contaminants.

REFERENCES:
patent: 3634600 (1972-06-01), Griffin
patent: 3767979 (1973-10-01), Reber et al.
patent: 3784884 (1974-01-01), Zoroglu
patent: 3936864 (1976-02-01), Benjamin
patent: 4150393 (1979-04-01), Wilson et al.
Preliminary Technical Bulletin 3-2-13, Dielectric Materials, Emerson & Cuming, Canton, Mass. 02021 (No date provided).
Ryton.RTM. R-4. . . Polyphenylene Sulfide, Phillips Chemical Company, pp. 2-3, Sep., 1978.

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