Low cost method to produce high volume lead frames

Details Low cost method to produce high volume lead frames Low cost method to produce high volume lead frames

2007-03-20

2007-03-20

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S666000, C257S670000, C257S676000, C257SE23031, C257SE23050, C257SE23043, C257SE23054

Reexamination Certificate

active

11060829

ABSTRACT:
A method (300) for fabricating a lead frame (100), comprising forming a plurality of external leads (122) in a lead frame material (108), plating a metal (222) on all surfaces of the lead frame material (108), and subsequently forming a plurality of internal leads (124) in the lead frame material (108). The lead frame material (108) may comprise of a portion of a contiguous metal sheeting (204) rolled upon a first coil (202), wherein the contiguous metal sheeting (204) is fed into an external lead stamping apparatus (206), thus forming the external leads (122), and rolled onto a second coil (215). The portion is fed into a plating apparatus and plated with the metal (222), and rolled onto a third coil (218) prior to forming the plurality of internal leads (124). The third coil (218) can be unrolled into an internal lead stamping apparatus (226), thus forming the internal leads (124) of a lead frame (100). The lead frame (100) is cleaned and subsequently rolled onto a fourth coil (238) to be cut into sheets (240).

REFERENCES:
patent: 5633528 (1997-05-01), Abbott et al.
patent: 6087714 (2000-07-01), Kubara et al.
patent: 6395583 (2002-05-01), Kubara et al.
patent: 6646330 (2003-11-01), Kubara et al.
patent: 6677056 (2004-01-01), Tanaka et al.
patent: 6828660 (2004-12-01), Abbott

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