Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1977-09-21
1980-01-08
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
156644, 156656, 156664, 156665, 156657, 204 15, 427 91, 427 92, 427 93, 427 94, 427 98, 427259, 430314, C23C 302
Patent
active
041827813
ABSTRACT:
Elevated metal contact bumps are provided on a microelectronic semiconductor circuit, with the use of aluminum-palladium metallization as a base for selective electroless plating. The aluminum and palladium are preferably deposited sequentially in a single operation, i.e., without exposing the aluminum surface to the atmosphere. The aluminum-palladium film is then patterned in a single step, using an etchant which attacks both metals at substantially the same rate. The metal pattern is then covered with an insulation layer wherein apertures are opened to expose palladium at selected sites for immersion in an electroless plating bath of ionic Cu or Ni for bump formation.
REFERENCES:
patent: 3239376 (1966-03-01), Schmidt
patent: 3453501 (1969-07-01), Dunkle
patent: 3579375 (1971-05-01), Wonilowicz
patent: 3597834 (1971-08-01), Lathrop
patent: 3623961 (1971-11-01), Van Laer
patent: 3663184 (1972-05-01), Wood
patent: 3669734 (1972-06-01), Jacob et al.
patent: 4005472 (1977-01-01), Harris
patent: 4122215 (1978-10-01), Vratny
Harrover Alexander J.
Hooper Robert C.
Terry Charles E.
VanHoy Michael J.
Comfort James T.
Grossman Rene E.
Honeycutt Gary C.
Smith John D.
Texas Instruments Incorporated
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