Radiant energy – Invisible radiant energy responsive electric signalling – Semiconductor system
Reexamination Certificate
1999-05-17
2001-07-10
Kim, Robert H. (Department: 2882)
Radiant energy
Invisible radiant energy responsive electric signalling
Semiconductor system
C378S098800
Reexamination Certificate
active
06259098
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates generally to x-ray diagnostic medical imaging and more particularly, to a flexible interconnection circuit for altering the resolution of an imaging system.
In many x-ray imaging system configurations, an x-ray source projects an area beam which is collimated to pass through a region of interest of the object being imaged, such as a patient. The beam, after being attenuated by the object, impinges upon an array of radiation detectors. The intensity of the radiation beam received at the detector array is dependent upon the attenuation of the x-ray beam by the object. Each detector element, or pixel, of the array produces a separate electrical signal that is a measurement of the beam attenuation at that location of the detector. The attenuation measurements from all the detector pixels are acquired separately to produce a transmission profile.
Due to the many different imaging requirements, multiple versions or configurations of x-ray systems must be developed, manufactured and supported in the field. More specifically, for a high resolution x-ray system, a high resolution detector array must be designed, tested and fabricated. In addition, a data acquisition system (DAS) must be designed, tested and fabricated to sample the large number of signals generated by the high resolution detector array. Additionally, unique interconnect cables must be developed to transfer the signals between the detector array and the DAS. In order to fabricate an x-ray system having a lower resolution, at least one known system utilizes a separately designed detector array having a lower resolution, DAS having fewer channels, and interconnect cable connecting each detector array line to each DAS channel. AS a result of the different configurations of the components, design costs and risks are increased. In addition, manufacturing and field support must be familiar with each configuration as well as stock inventory of each component.
It would be desirable to provide an imaging system which minimizes the umber of components which must be changed to alter the resolution of the system. It would also be desirable to provide a flexible interconnect circuit which allows the resolution of the imaging system to be quickly and inexpensively modified.
BRIEF SUMMARY OF THE INVENTION
These and other objects may be attained by a flexible interconnect connection which, in one embodiment, alters the resolution of an imaging system by combining detector array signal lines. Particularly, the flexible interconnect cable includes a plurality of first end contacts, a plurality of second end contacts and a plurality of conductors extending between the first end contacts and the second end contacts. By altering the configuration of the flexible interconnect cable, the resolution of the imaging system is altered. More specifically, while utilizing a common detector array and common DAS components, the resolution of the imaging system is altered by electrically combining different numbers of detector array signals lines to each DAS channel.
In one embodiment, where the detector array includes M×N pixels, the physical dimensions of at least a portion of the first end contacts are modified so that two output data lines from the detector array are electrically connected to each DAS channel so that the resolution of the system is reduced to M/2 by N. As a result of altering only the flexible interconnect circuit, a common detector array and common DAS module design may be utilized, thereby reducing the number of components which must be designed, fabricated, and field supported. In addition, where the DAS includes a plurality of modules, the number of modules may be reduced as a result of the reduced number of detector array signals.
The above described imaging system minimizes the number of components which must be modified to alter the resolution of the imaging system. In addition, the above described flexible interconnect cable enables the resolution of the imaging system to be quickly and inexpensively modified.
REFERENCES:
patent: 4161655 (1979-07-01), Cotic et al.
patent: 5822392 (1998-10-01), Hedengren
patent: 5896173 (1999-04-01), Hassler
patent: 5974109 (1999-10-01), Hsieh
patent: 6081576 (2000-08-01), Schanen et al.
patent: 6091795 (2000-07-01), Schafer et al.
patent: 6115448 (2000-09-01), Hoffman
patent: B1 6173031 (2001-01-01), Hoffman et al.
Petrick Scott W.
Vafi Habib
Armstrong Teasdale LLP
Cabou Christian G.
General Electric Company
Ho Allen C.
Kim Robert H.
LandOfFree
Low cost, low resolution interconnect for a solid-state... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low cost, low resolution interconnect for a solid-state..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low cost, low resolution interconnect for a solid-state... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2478832