Low cost integrated circuit bonding process

Details Low cost integrated circuit bonding process Low cost integrated circuit bonding process

1985-08-22

1987-04-28

Czaja, Donald E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29827, 156330, 357 80, 361411, H01L 2310, H01R 4302

Patent

active

046611924

ABSTRACT:
A low cost process for bonding a plurality of integrated circuit die to a variety of die support frames using existing, readily available equipment. Tape automatic bonding (TAB) processes offer a number of new possibilities in the assembly and packaging of integrated circuits. However, the investigation of TAB techniques or the use of TAB techniques on low volume parts is prohibited by the high cost of "bumping" or putting interconnection balls on the chip or the tape leads. The process permits placing balls on the bonding pads of a plurality of die by a wire bonder, cutting off the wire, planarizing the balls, coating the planarized region with a conductive epoxy and then registering and bonding the die to corresponding conductive patterns on die support frames.

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DeBoskey, W. R., "Directly Attached Integrated Circuit Lead Frame", IBM Tech. Discl. Bull., vol. 15, No. 1, Jun. 1972, pp. 307.
Berndlmaier, et al., "High Performance Package", IBM Tech. Discl. Bull., vol. 20, No. 8, Jan. 1978, p. 3090.
Stephans, E., "Pinless Module Connector", IBM Tech. Discl. Bull., vol. 20, No. 10, Mar. 1978, pp. 3872.

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