Low-cost high-performance semiconductor chip package

Details Low-cost high-performance semiconductor chip package Low-cost high-performance semiconductor chip package

1988-11-21

1990-12-25

Hille, Rolf

357 70, 357 75, 357 80, H01L 2302, H01L 2312, H01L 2348, H01L 2944

Patent

active

049807536

ABSTRACT:
Disclosed is a low-cost high-performance semiconductor chip package enabling a direct chip to printed circuit board connection. The package comprises a semiconductor chip having a front surface and a back surface. The front surface comprises pads for input and output of signals to and from the chip. The package further comprises a leadframe having power, ground, and signal conductive elements having first and second end portions for transmitting input and output signals to the pads. The package also comprises a bonding system for selectively connecting the first end portions of the conductive elements to the pads and a protective system for providing sealed and environmental protection around the semiconductor chip and portions of the leadframe while permitting other portions of the leadframe to protrude from the protective means to provide connection with other devices.

REFERENCES:
patent: 3517438 (1970-06-01), Johnson et al.
patent: 3522490 (1970-08-01), Kaufman
patent: 3869787 (1975-03-01), Umbaugh
patent: 4084869 (1978-04-01), Yen
patent: 4405188 (1983-09-01), Schwartz
patent: 4420794 (1983-12-01), Anderson
patent: 4449011 (1984-05-01), Kratochvil et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4554505 (1985-11-01), Zachry
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4639058 (1987-01-01), Morgan
patent: 4696526 (1987-09-01), Newton et al.
patent: 4703984 (1987-11-01), Mitchell, Jr.
patent: 4734749 (1988-03-01), Levi
patent: 4754317 (1988-06-01), Comstock et al.
Solder Reflow Chip Joiner, IBM Technical Disclosure Bulletin, vol. 16, No. 2. Jul. 1973, p. 416.

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