Low cost high density rectifier matrix memory

Static information storage and retrieval – Format or disposition of elements

Reexamination Certificate

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C365S201000

Reexamination Certificate

active

07460384

ABSTRACT:
A high density memory device is fabricated three dimensionally in layers. To keep points of failure low, address decoding circuits are included within each layer so that, in addition to power and data lines, only the address signal lines need be interconnected between the layers.

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