Low cost, hermetic pin grid array package

Details Low cost, hermetic pin grid array package Low cost, hermetic pin grid array package

1987-12-09

1989-08-29

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

174 506, 29842, 361406, H05K 118

Patent

active

048619442

ABSTRACT:
A pin grid array package includes an electrically insulating, moisture impervious base having a plurality of bores therethrough, electrically conducting pins extending through the bores, metallic collars wedged between the pins and the bores adjacent the bottom side of the base, an electrically conducting trace formed of a silver-2 percent platinum alloy extending from each pin to the location for attachment of an electrical device, and a melted eutectic bond between the metal of the conducting path and the head of the pin at the top side of the base.

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Darrow et al., Increased Wiring Area for Standard Pinned Substrates, IBM Tech. Discl. Bull., vol. 25, #1, Jun. 1982, p. 288.

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