Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials
Reexamination Certificate
2004-12-08
2010-10-26
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Portion of housing of specific materials
C257S772000
Reexamination Certificate
active
07821129
ABSTRACT:
Hermeticity of microcircuit packages is achieved in one embodiment by recognition that water can penetrate the ceramic structure and thus the ceramic structure is sealed and the edges of the ceramic package are metallically bonded to the electronic package. In one embodiment, a clear ceramic dielectric compound is sprayed on the ceramic and then the package is glazed.
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Agilent Technologie,s Inc.
Chambliss Alonzo
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