Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2008-09-24
2011-10-11
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S464000
Reexamination Certificate
active
08034663
ABSTRACT:
Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be glass with the IC elements grown on the glass. In some embodiments, the release member can be used for a low cost placement of the IC elements in combination with an intermediate transfer layer.
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Baek Seung-Ho
Kerr Roger S.
Tredwell Timothy J.
Blish Nelson Adrian
Eastman Kodak Company
Perkins Pamela E
Smith Zandra
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