Low cost assembly processes for non-linear resistors and ceramic

Details Low cost assembly processes for non-linear resistors and ceramic Low cost assembly processes for non-linear resistors and ceramic

1978-06-15

1980-02-19

Larson, Lowell A.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

29589, 29628, 357 10, H01B 108

Patent

active

041890841

ABSTRACT:
A brazing operation, using a silver-copper alloy preform in a temperature range of from 800.degree. C. to 1100.degree. C., is employed to attach either radial or axial conductive leads to ceramic non-linear resistors or capacitors, thereby eliminating the necessity of titanium-silver vacuum deposition or conductive cermet application prior to lead attachment. Glass encapsulation may be accomplished simultaneous with the brazing operation to further reduce cost.

REFERENCES:
patent: 2859394 (1958-11-01), Berman
patent: 3820239 (1974-06-01), Nagata

Affiliated with

Also associated with

Rating

Low cost assembly processes for non-linear resistors and ceramic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low cost assembly processes for non-linear resistors and ceramic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low cost assembly processes for non-linear resistors and ceramic will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-649896