Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2008-05-13
2008-05-13
Nguyen, Cuong (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S537000, C257SE21004
Reexamination Certificate
active
07372127
ABSTRACT:
Resistor devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The conductive materials comprise between about 20% and about 50% of the total weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.
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Co-pending U.S. Patent App. INT-01-002-CIP, filed Dec. 4, 2002, U.S. Appl. No. 10/309,429, “Low Cost Antennas Using Conductive Plastics or Conductive Composites”, assigned to the same assignee.
Integral Technologies, Inc.
Nguyen Cuong
Schnabel Douglas
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