Low corrosivity catalyst for activation of copper for electroles

Details Low corrosivity catalyst for activation of copper for electroles Low corrosivity catalyst for activation of copper for electroles

1991-09-23

1993-05-18

Shine, W. J.

Catalyst, solid sorbent, or support therefor: product or process

Catalyst or precursor therefor

Halogen or compound containing same

427305, B01J 2358, B01J 2713

Patent

active

052121380

ABSTRACT:
This invention relates to electroless nickel plating of metals which are normally noncatalytic for electroless nickel initiation. It is especially useful in the electronics industry, including production of electroless nickel/electroless gold tabs or surface mount pads on printed circuit boards, and for use in electroless nickel plating over copper for radiofrequency interference shielding. More particularly, it comprises alkali halide salt solutions of a palladium salt with another Group VIII precious metal salt in an inorganic acid solution for effectively and completely catalyzing the initiation of electroless nickel plating on copper substrates.

REFERENCES:
patent: 3874882 (1975-04-01), Gulla et al.
patent: 3969554 (1976-07-01), Zeblisky
G. G. Gawrilou, Chemical (Electroless) Nickel Plating, Portcallis Press, 1979, p. 114 plus title and 1st Table of Contents page (3 total).

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