Low corrosivity catalyst containing ammonium ions for activation

Details Low corrosivity catalyst containing ammonium ions for activation Low corrosivity catalyst containing ammonium ions for activation

1991-09-23

1993-06-15

Shine, W. J.

Catalyst, solid sorbent, or support therefor: product or process

Catalyst or precursor therefor

Nitrogen compound containing

427304, 427305, B01J 2344, B01J 2346, B01J 2708, B01J 2710

Patent

active

052198154

ABSTRACT:
This invention relates to electroless nickel plating of metals which are normally noncatalytic for electroless nickel initiation. It is especially useful in the electronics industry, such as for production of electroless nickel/electroless gold tabs or surface mount pads on printed circuit boards, and for use in electroless nickel plating over copper for radiofrequency interference shielding. More particularly, it comprises ammonium halide salt solutions of a palladium salt with another Group VIII precious metal salt and acid and optionally an alkali halide salt for effectively and completely catalyzing the initiation of electroless nickel plating on copper substrates.

REFERENCES:
patent: 4066804 (1978-01-01), Andrews
patent: 4719145 (1988-01-01), Neely
patent: 4804410 (1989-02-01), Haga et al.
G. G. Gawrilov, Chemical (Electroless) Nickel Plating, Port Callis Press, 1979, p. 114 & title and 1st table of contents page (3 total).

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