Low compliance seal for gas-enhanced wafer cooling in vacuum

Details Low compliance seal for gas-enhanced wafer cooling in vacuum Low compliance seal for gas-enhanced wafer cooling in vacuum

1986-05-16

1987-06-09

McIntosh, John P.

Coating apparatus

With heat exchange, drying, or non-coating gas or vapor...

With solid heat exchange means contacting work

118503, 165 804, F28F 900, B05C 1302

Patent

active

046712046

ABSTRACT:
Apparatus for thermal transfer with a semiconductor wafer in a vacuum processing chamber includes a platen with a surface for supporting the wafer, a clamping ring for clamping the wafer to the platen, and passages for supplying a low pressure gas into a thermal transfer region between the wafer and the platen surface. A low compliance seal surrounds the thermal transfer region and inhibits the gas from reaching the processing chamber without overstressing the wafer. The seal includes an elastomer ring having an elongated cross-section, and a sealing groove having a first groove portion for gripping one edge of the ring and a second groove portion which receives the other edge of the ring by bending deformation thereof when a wafer is clamped to the platen. In a preferred embodiment, the ring has a parallelogram-shaped cross-section and is oriented at an acute angle to the platen surface.

REFERENCES:
patent: 4282924 (1981-08-01), Faretra
patent: 4457359 (1984-07-01), Holden
patent: 4542298 (1985-09-01), Holden

Affiliated with

Also associated with

Rating

Low compliance seal for gas-enhanced wafer cooling in vacuum does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low compliance seal for gas-enhanced wafer cooling in vacuum, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low compliance seal for gas-enhanced wafer cooling in vacuum will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1822117