Low coefficient of thermal expansion (CTE) thermosetting...

Details Low coefficient of thermal expansion (CTE) thermosetting... Low coefficient of thermal expansion (CTE) thermosetting...

2011-08-16

2011-08-16

Sellers, Robert (Department: 1765)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S533000

Reexamination Certificate

active

07999042

ABSTRACT:
An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.

REFERENCES:
patent: 5218062 (1993-06-01), Earls et al.
patent: 5264502 (1993-11-01), Hefner et al.
patent: 5412057 (1995-05-01), Hefner et al.
patent: 5567749 (1996-10-01), Sawamura et al.
patent: 2-117913 (1990-05-01), None
patent: 6-179736 (1994-06-01), None
Mihara et al., “Synthesis and Thermal Properties of Combined Liquid Crystalline Epoxy Resins,” Journal of Applied Polymer Science, 1998, vol. 68, pp. 1979-1990.
CAPLUS accession No. 2004:207556 for Ichikawa et al., “Electronic structure and molecular orientation of epoxy resin network chains and its application for molding compound for IC packages,” Nippon Setchaku Gakkaishi, 2004, two pages.

Affiliated with

Also associated with

Rating

Low coefficient of thermal expansion (CTE) thermosetting... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low coefficient of thermal expansion (CTE) thermosetting..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low coefficient of thermal expansion (CTE) thermosetting... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2620201