Low capacitance integrated circuit package

Details Low capacitance integrated circuit package Low capacitance integrated circuit package

1989-02-06

1990-06-05

Edlow, Martin H.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 70, 357 65, 174 523, 174 524, H01L 2302

Patent

active

049318543

ABSTRACT:
An integrated circuit package utilizing low temperature sealing glass and having reduced lead capacitance. Voids in the glass material on the base substrate and the cap substrate result in the formation of glass-free cavities when the base substrate is fused to the cap substrate. A lead frame extending from and passing through the glass material which couples the base substrate to the cap substrate also passes through the glass-free cavities, resulting in a reduced parasitic capacitance of the package leads.

REFERENCES:
patent: 3484534 (1969-12-01), Kilby et al.
patent: 3566212 (1971-02-01), Marx
patent: 3617819 (1971-02-01), Boisvert et al.
patent: 3668299 (1972-06-01), McNeal
patent: 3760090 (1973-09-01), Fowler
patent: 4038488 (1977-07-01), Lin
patent: 4142203 (1979-02-01), Dietz
patent: 4701424 (1987-10-01), Mikkor

Affiliated with

Also associated with

Rating

Low capacitance integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low capacitance integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low capacitance integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-495389