Electric lamp or space discharge component or device manufacturi – Process – With assembly or disassembly
Patent
1990-09-27
1991-10-15
Seidel, Richard K.
Electric lamp or space discharge component or device manufacturi
Process
With assembly or disassembly
313309, 313336, 313351, 156647, H01J 130
Patent
active
050570471
ABSTRACT:
A method for fabricating field emitter arrays is disclosed which uses a substrate as both an emitter tip mold and an insulating layer. A thick single crystal substrate is orientation-dependent-etched on one side to form a plurality of holes having crystallographically sharp apices or a non-crystalline substrate is etched on one side to form a plurality of holes with a high depth-to-width ratio. An emitter layer is deposited on the substrate surface and in the plurality of holes. The remainder of the field emitter array structure is then formed on the opposite side of the substrate using conventional deposition and etching techniques. Once the emitter is formed, the remaining fabrication steps are self-aligning. The field emitter array thus formed exhibits high input impedance at high frequency, making the field emitter array suitable for high frequency uses.
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IBM Technical Disclosure Bulletin, vol. 23, No. 5, Oct. 1980, pp. 1915-19 6.
Gray Henry F.
Greene Richard F.
Knapp Jeffrey T.
McDonnell Thomas E.
Miles Edward F.
Seidel Richard K.
The United States of America as represented by the Secretary of
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