Low bromine-content materials for manufacturing printed circuit

Details Low bromine-content materials for manufacturing printed circuit Low bromine-content materials for manufacturing printed circuit

1992-06-25

1995-05-09

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525486, 523428, C08G 5914, C08L 6202, C08L 6304, C08K 507

Patent

active

054140595

ABSTRACT:
A resinous material for the manufacture of printed circuit boards is obtained by (a) treating a mixture of bromine- and nonbromine-containing epoxy resins with a secondary diamine such as 5,5-dimethyl hydantion or barbituric acid in the presence of a tertiary amine catalyst to form a modified epoxy resin; (b) heating the modified epoxy resin and a polyisocyanate in the presence of an encyclization catalyst; and (c) dissolving the resulting product in a solvent with a curing agent to form a B-stage prepreg varnish.

REFERENCES:
patent: 4294877 (1981-10-01), Graham
patent: 4433078 (1984-02-01), Kersten et al.
patent: 5041519 (1991-08-01), Pan et al.
patent: 5326794 (1994-07-01), Pan et al.

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