Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1992-06-24
1995-02-21
Ramsey, Kenneth J.
Metal fusion bonding
Process
With protecting of work or filler or applying flux
228219, 228223, B23K 100
Patent
active
053908457
ABSTRACT:
A process for wave soldering or reflow soldering comprises contacting substrates with a supply of molten solder containing from about 0.0001 to about 0.1% by weight of phosphorous in an atmosphere of diluent gas containing up to about 0.1% by volume oxygen. A reduced incidence of bridging and other soldering defects occurs.
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Kent Peter
Knapp Jeffrey T.
O'Brien Cornelius
Praxair Technology Inc.
Ramsey Kenneth J.
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