Low application temperature hot melt with excellent heat and col

Details Low application temperature hot melt with excellent heat and col Low application temperature hot melt with excellent heat and col

1997-07-14

1999-08-17

Szekely, Peter A.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524271, 524274, 524292, 524293, 524478, 524488, 524489, 524490, 524499, 524505, 525 98, 525 99, C08L 9106, C08L 9304, C08L 5302, C08K 512

Patent

active

059394838

ABSTRACT:
A hot melt useful for packaging comprising a) from about 10% to about 40% by weight of a block copolymer; b) up to about 20% of a compatible polymer wherein the total polymer content does not exceed 40% by weight; c) from about 25% to about 60% by weight of at least one tackifying resin; d) from about 5% to about 25% by weight of a compatible plasticizer; and e) from about 10% to about 40% by weight of at least one wax component wherein the viscosity of the hot melt adhesive is less than about 1500 cPs at about 150.degree. C.

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