Low application temperature hot melt adhesive

Details Low application temperature hot melt adhesive Low application temperature hot melt adhesive

2006-03-28

2006-03-28

Lipman, Bernard (Department: 1713)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C524S272000, C524S277000, C524S487000, C524S489000, C524S508000

Reexamination Certificate

active

07019060

ABSTRACT:
A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from about 5 to about 60 weight percent ethylene vinyl acetate with about 30 to about 50 weight percent VA content and having a melt index of about 700 to about 4,000 dg/min; a tackifier; and wax with a melting point of about 125 to about 180° F.

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