Low application temperature hot melt adhesive

Details Low application temperature hot melt adhesive Low application temperature hot melt adhesive

1998-02-04

2000-09-12

Boykin, Terressa M.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

524487, C08K 507

Patent

active

061179450

ABSTRACT:
A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from ethylene vinyl acetate with greater than 30 weight percent VA and having a melt index of at least 700; a thermoplastic hydrocarbon resin derived from styrene, alpha-methylstyrene, and/or vinyltoluene, and polymers, copolymers and terpolymers thereof; a compatible adhesive promoting tackifier; and wax with a melting point of about 130 to 170 .degree. F.; and optionally comprising ethylene vinyl acetate with less than about 30 weight percent by weight of vinyl acetate and having a melt index of about 400 to 2500.

REFERENCES:
patent: 3932332 (1976-01-01), Douglas et al.
patent: 4113801 (1978-09-01), Douglas et al.
patent: 4358557 (1982-11-01), Boggs
patent: 4497936 (1985-02-01), Tancrede et al.
patent: 4497941 (1985-02-01), Aliani et al.
patent: 5373049 (1994-12-01), Ornstern et al.
Kristalex.RTM. 3100, Highly Stable, Water-Clear Thermoplastic Resin; Technical Information No. 7159-8; Hercules Incorporated, Wilmington, DE.

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