Abrading – Machine – Rotary tool
Reexamination Certificate
2005-07-05
2005-07-05
Nguyen, George (Department: 3723)
Abrading
Machine
Rotary tool
C451S286000, C451S287000, C451S288000, C451S289000, C451S165000, C451S270000
Reexamination Certificate
active
06913528
ABSTRACT:
A method and apparatus for improving uniformity of the rate of removal of material from the surface of a workpiece, such as semiconductor substrate, by polishing. In accordance with the invention, the workpiece is subjected to a vibratory polishing method, and optionally at least one additional polishing motion selected from rotational, oscillating, sweeping, orbital and linear polishing motions. As a result, polished workpieces, such as semiconductor wafers, have reduced surface defects, improved planarity, and are polished more uniformly over a wider area.
REFERENCES:
patent: 5187899 (1993-02-01), Rhoades
patent: 5313741 (1994-05-01), Toyama
patent: 5315792 (1994-05-01), Schweizer et al.
patent: 5554064 (1996-09-01), Breivogel et al.
patent: 6135858 (2000-10-01), Takahashi
patent: 6152805 (2000-11-01), Takahashi
patent: 6159080 (2000-12-01), Talieh
patent: 6184139 (2001-02-01), Adams et al.
patent: 6343978 (2002-02-01), Shimizu et al.
patent: 6390903 (2002-05-01), Takahashi et al.
patent: 6413156 (2002-07-01), Shimizu et al.
patent: 6500055 (2002-12-01), Adams et al.
NOTE: Applicant is not aware of any patents, publications, or other information for consideration by the Patent Office.
Herb John D.
Schulz Stephen C.
Nguyen George
Snell & Wilmer L.L.P.
SpeedFam-IPEC Corporation
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