Low-alloy (Ni-Sn-Ti) copper alloy

Alloys or metallic compositions – Copper base – Tin containing

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420488, 420492, C22C 902, C22C 906

Patent

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046108432

ABSTRACT:
A low-alloyed copper alloy suitable for use as a base material for a semiconductor includes 0.03 to 0.2% nickel by weight, 0.03 to 0.2% tin by weight; and 0.015 to 0.1% titanium by weight, the remainder being copper and common impurities.

REFERENCES:
patent: 4337089 (1982-06-01), Arita et al.
patent: 4366117 (1982-12-01), Tsuji

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