Lot-to-lot feed forward CMP process

Details Lot-to-lot feed forward CMP process Lot-to-lot feed forward CMP process

2005-02-22

2005-02-22

Rachuba, M. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S041000, C451S287000

Reexamination Certificate

active

06857938

ABSTRACT:
One embodiment disclosed relates to a chemical-mechanical polishing process. The process includes performing chemical-mechanical polishing on an entire wafer lot without look ahead polishing of a first article wafer. A normalized polish rate is determined, and a process time for a next wafer lot is predicted using the normalized polish rate. Another embodiment of the invention relates to a polishing apparatus for chemical-mechanical planarization of semiconductor wafers.

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Boning, Duane, et al, “Run by Run Control of Chemical-Mechanical Polishing”, IEEE Trans. CPMT (C), vol. 19, No. 4, pp. 307-314, Oct. 1996.

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